Bluetooth® IC
Toshiba LE Gen-II ultra-low-power complete model
Single-chip implementation for coin-cell-operated data communication applications
| Feature | Ultra-low power / LE single / User Flash / Scatternet support / Standalone mode support / Small QFN package / LE Data Length Extension support / LE Secure Connection supoort |
|---|---|
| Automotive Support | N/A |
| Bluetooth Category | Bluetooth® low energy |
| Bluetooth Core spec. | 4.2 |
| Embedded Profiles | GATT / SMP |
| Interfacing | I2C / SPI / UART / PWM / ADC / SWD |
| User RAM Size (KB) | 83 |
| User Flash Size (KB) | 256 |
| Function | ARM® Cortex®-M0 / 50ohm impedance for RF IO / DC-DC converter / low power mode(4 level) |
| Other Functions | LE data length extension / LE secure connection / Scatternet |
| RoHS Compatible Product(s) (#) | Available |
| Assembly bases | 日本 |
| Status | Under mass production |
| Toshiba Package Name | P-VQFN40-0505-0.40-005/F01 |
|---|---|
| Package name | QFN |
| Pins | 40 |
| Mounting | Surface Mount |
| Package size | 5.0 mm x 5.0 mm |
| Pin pitch | 0.4 mm |
| Package Dimensions | 查看 |
Please refer to the link destination to check the detailed size.
| 项目 | 符号 | 条件 | 数值 | 单位 |
|---|---|---|---|---|
| Operating Temperature (Max) | Topr | - | 85 | ℃ |
| Operating Temperature (Min) | Topr | - | -40 | ℃ |
| Power supply voltage (Max) | - | - | 3.6 | V |
| Power supply voltage (Min) | - | - | 1.9 | V |
| Current Consumption in RX Active mode (peak) | IRX | (3.0V) | 3.3 | mA |
| Current Consumption in TX Active mode (peak) | ITX | (3.0V, TX -0dBm) | 3.3 | mA |
| Current Consumption in Sleep mode | ISleep | - | 1.8 | μA |
| Current Consumption in Deep Sleep mode | IDSleep | - | 0.05 | μA |
| Transmit Power(Max) | PTrans | - | 0 | dBm |
| Receiver Sensitivity | - | - | -93.5 | dBm |
