Hot Keywords:
PRODUCTS CENTER
- Aluminum electrolytic capacitor
- Bolt type Ox horn type Lead type Patch type Unpolarized capacitor Horizontal capacitor Fixed product Solid state capacitance Solid-liquid mixed capacitor Ultracapacitor
- TOSHIBA
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- MOSFET
- Bipolar Transistor/IGBT/IEGT
- diode
- Optical semiconductor
- Universal Linear IC
- Universal Logic IC
- sensor
- Micro controller
- Customized SoC
- IC for Wireless
- Vehicle components
- Image Recognition Processor Visconti™
- Special Image Processing IC for Vehicle Display
- Vehicle Audio IC
- Power Amplifier IC
- Vehicle Microcontroller
- simulation ASSP
- Vehicle Motor Driver
- Power Supply for Vehicle System
- Vehicle Communication RF-IC
- Special IC for Vehicle Communication Service (ETC/DSRC)
- vehicle MOSFET
- vehicle IPD
- Storage Solution of Automotive Information and Entertainment System
- Vehicle Bridge Chip
- Small packaged on-board components
- Vehicle optocoupler/optical relay
- Dedicated IC
- High frequency device
- Packaging and Packaging
- Product naming rules
微控制器举例1
- 东芝微控制器
-
微控制器内核
89：870／C 92：900/H1 -
ROM类型
C：掩膜 E：EEPROM F：闪存 P：OTP -
ROM尺寸
1 2 3 4 6 8 C H K M N P S U W F Y Z D KB 1 2 3 4 6 8 12 16 24 32 40 48 60／64 96 124／128 192 256 384 512 - 微控制器子类型
- 微控制器版本
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汽车质量等级
R：A级，－40°C~+85°C T：A级，－40°C~+125°C
I：B级，－40°C~+85°C S：B级，－40°C~+125°C -
封装
QG：塑料收缩四边形无引线封装（VQON）；干燥包装
XBG：塑料球栅阵列（BGA）；干燥包装
WBG：晶圆级芯片尺寸封装（WCSP）；干燥包装
UG、DUG、FG、DFG：塑料四边形扁平封装（QFP）；干燥包装
MG、DMG：塑料小外形封装（SOP）；干燥包装
NG：塑料收缩双列直插式封装（SDIP）