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TC35661IDBG-009

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TC35661IDBG-009

Bluetooth® IC

Automotive HCI model for wide-band speech applications
Suitable for high-quality hands-free systems

产品概要

Feature Automotive / (BR/EDR)+LE dual / WBS support / Voice codec
Automotive Support Available
Bluetooth Category Bluetooth® dual-mode
Bluetooth Core spec. 4.2
Embedded Profiles HCI
Interfacing I2C / SPI / UART / I2S / PCM / Wi-Fi coexistence
User RAM Size (KB) N/A
User Flash Size (KB) N/A
Function ARM® ARM7TDMI-S™ / RF analog circuitry / low power mode
Other Functions Wide Band Speech / Voice codec
RoHS Compatible Product(s) (#) Available
Assembly bases 日本
Status Under mass production

封装类型

Toshiba Package Name P-LFBGA64-0707-0.80-001
Package name BGA
Pins 64
Package size 7.0 mm x 7.0 mm
Pin pitch 0.8 mm

 Please refer to the link destination to check the detailed size.

产品特性

项目 符号 条件 数值 单位
Operating Temperature (Max) Topr - 85
Operating Temperature (Min) Topr - -40
Power supply voltage (Max) - - 3.6 V
Power supply voltage (Min) - - 2.7 V
Current Consumption in RX Active mode (peak) IRX (3.3V) 63 mA
Current Consumption in TX Active mode (peak) ITX (3.3V) 63 mA
Current Consumption in Sleep mode ISleep - 30 μA
Transmit Power(Max) PTrans - 2 dBm
Receiver Sensitivity - - -91 dBm

 

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