中文繁体English 您好!欢迎进入广东美日康电容器制造有限公司官网!

全国免费咨询热线:

18998946834(微信同号)

产品分类

PRODUCTS CENTER

铝电解电容器
螺栓型 牛角型 引线型 贴片型 无极性电容 卧式电容 定制品 超级电容 固液混合电容 固态电容
东芝

TC35661SBG-009

立即咨询PDF下载

TC35661SBG-009

Bluetooth® IC

HCI model for wide-band speech applications
Suitable for high voice auality systems such as a hands-free and a handsets

产品概要

Feature (BR/EDR)+LE dual / WBS support / Voice codec / Small BGA Package
Automotive Support N/A
Bluetooth Category Bluetooth® dual-mode
Bluetooth Core spec. 4.2
Embedded Profiles HCI
Interfacing I2C / SPI / UART / I2S / PCM / Wi-Fi coexistence
User RAM Size (KB) N/A
User Flash Size (KB) N/A
Function ARM® ARM7TDMI-S™ / RF analog circuitry / low power mode
Other Functions Wide Band Speech / Voice codec
RoHS Compatible Product(s) (#) Available
Assembly bases 日本
Status Under mass production

封装类型

Toshiba Package Name P-TFBGA64-0505-0.50
Package name BGA
Pins 64
Package size 5.0 mm x 5.0 mm
Pin pitch 0.5 mm

 Please refer to the link destination to check the detailed size.

产品特性

项目 符号 条件 数值 单位
Operating Temperature (Max) Topr - 85
Operating Temperature (Min) Topr - -40
Power supply voltage (Max) - - 3.6 (*2) V
Power supply voltage (Min) - - 1.7 (*2) V
Current Consumption in RX Active mode (peak) IRX (3.3V) 63 mA
Current Consumption in TX Active mode (peak) ITX (3.3V) 63 mA
Current Consumption in Sleep mode ISleep - 30 μA
Transmit Power(Max) PTrans - 2 dBm
Receiver Sensitivity - - -91 dBm
- Power supply voltage: 1.7 to 1.9 or 2.7 to 3.6. -

 

(*2) Power supply voltage: 1.7 to 1.9 or 2.7 to 3.6.

技术支持:万广互联Copyright © 2010-2023 广东美日康电容器制造有限公司 All Right ReservedICP备2023119727号
  • 官方微信