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TC35678FXG-002

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TC35678FXG-002

Bluetooth® IC

Toshiba LE Gen-II ultra-low-power complete model
Single-chip implementation for coin-cell-operated data communication applications

产品概要

Feature Ultra-low power / LE single / User Flash / Scatternet support / Standalone mode support / LE Data Length Extension support / LE Secure Connection supoort
Automotive Support N/A
Bluetooth Category Bluetooth® low energy
Bluetooth Core spec. 4.2
Embedded Profiles GATT / SMP
Interfacing I2C / SPI / UART / PWM / ADC / SWD
User RAM Size (KB) 83
User Flash Size (KB) 256
Function ARM® Cortex®-M0 / 50ohm impedance for RF IO / DC-DC converter / low power mode(4 level)
Other Functions Scatternet / LE data length extension / LE secure connection
RoHS Compatible Product(s) (#) Available
Assembly bases 日本
Status Under mass production

封装类型

Toshiba Package Name P-VQFN60-0707-0.40
Package name QFN
Pins 60
Package size 7.0 mm x 7.0 mm
Pin pitch 0.4 mm

 Please refer to the link destination to check the detailed size.

产品特性

项目 符号 条件 数值 单位
Operating Temperature (Max) Topr - 85
Operating Temperature (Min) Topr - -40
Power supply voltage (Max) - - 3.6 V
Power supply voltage (Min) - - 1.9 V
Current Consumption in RX Active mode (peak) IRX (3.0V) 3.3 mA
Current Consumption in TX Active mode (peak) ITX (3.0V, TX -0dBm) 3.3 mA
Current Consumption in Sleep mode ISleep - 1.8 μA
Current Consumption in Deep Sleep mode IDSleep - 0.05 μA
Transmit Power(Max) PTrans - 0 dBm
Receiver Sensitivity - - -93.5 dBm

 

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